Metal solid-phase diffusion bonding method, ceramic connecting piece prepared by method, and application of ceramic connecting piece
The invention belongs to the technical field of ceramic connection, and discloses a metal solid-phase diffusion connection method and application thereof. The method includes: placing a high-temperature-resistant active metal serving as a connection material between polished SiC or Si3N4 ceramic con...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention belongs to the technical field of ceramic connection, and discloses a metal solid-phase diffusion connection method and application thereof. The method includes: placing a high-temperature-resistant active metal serving as a connection material between polished SiC or Si3N4 ceramic connected with the surface of a base material and doped with a liquid-phase sintering aid to form a sandwich structure, wherein the liquid-phase sintering aid is Al2O3-Re2O3; and under a protective atmosphere, mechanically pressurizing the sandwich structure at an air pressure of 10-10 Pa, and sintering at 1200-1500 DEG C to obtain the SiC or Si3N4 ceramic connecting piece. According to the invention, after connection, the thickness of the middle layer is 10-100 [mu]m, the shear strength of the connecting piece at room temperature is 60-150 MPa, the shear strength of the connecting piece at 1200 DEG C is 50-100 MPa, and the ceramic joint can be applied to the fields of aerospace and nuclear energy.
本发明属于陶瓷连接技术领域,公开了一种 |
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