TAPE FOR ELECTRONIC COMPONENT AND METHOD OF PROCESSING ELECTRONIC COMPONENT
Provided are a tape for an electronic component and a method of processing an electronic component, which can sufficiently follow a semiconductor wafer having a bump with a large height and can prevent a dimple from occurring on the ground surface of the semiconductor wafer. The tape 1 for an electr...
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| creator | OKURA MASATO |
| description | Provided are a tape for an electronic component and a method of processing an electronic component, which can sufficiently follow a semiconductor wafer having a bump with a large height and can prevent a dimple from occurring on the ground surface of the semiconductor wafer. The tape 1 for an electronic component according to the present invention is characterized in that the tape 1 has at least one resin layer 3, the resin layer 3 has a storage modulus of 10,000 to 200,000 Pa at any temperature of 60 DEG C to 80 DEG C, and the melt flow rate is 10 g/10 min to 200 g/10 min.
提供即使对于具有高度大的凸块的半导体晶片亦可充分进行追随，并且可防止在半导体晶片磨削面产生凹痕的电子部件用胶带及电子部件的加工方法。基于本发明的电子部件用胶带(1)具有至少1层树脂层(3)，关于树脂层(3)，储能模量在60℃～80℃的任意温度条件下为10000～200000Pa，熔体流动速率为10～200g/10min。 |
| format | Patent |
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提供即使对于具有高度大的凸块的半导体晶片亦可充分进行追随，并且可防止在半导体晶片磨削面产生凹痕的电子部件用胶带及电子部件的加工方法。基于本发明的电子部件用胶带(1)具有至少1层树脂层(3)，关于树脂层(3)，储能模量在60℃～80℃的任意温度条件下为10000～200000Pa，熔体流动速率为10～200g/10min。</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201208&DB=EPODOC&CC=CN&NR=112055736A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201208&DB=EPODOC&CC=CN&NR=112055736A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKURA MASATO</creatorcontrib><title>TAPE FOR ELECTRONIC COMPONENT AND METHOD OF PROCESSING ELECTRONIC COMPONENT</title><description>Provided are a tape for an electronic component and a method of processing an electronic component, which can sufficiently follow a semiconductor wafer having a bump with a large height and can prevent a dimple from occurring on the ground surface of the semiconductor wafer. The tape 1 for an electronic component according to the present invention is characterized in that the tape 1 has at least one resin layer 3, the resin layer 3 has a storage modulus of 10,000 to 200,000 Pa at any temperature of 60 DEG C to 80 DEG C, and the melt flow rate is 10 g/10 min to 200 g/10 min.
提供即使对于具有高度大的凸块的半导体晶片亦可充分进行追随，并且可防止在半导体晶片磨削面产生凹痕的电子部件用胶带及电子部件的加工方法。基于本发明的电子部件用胶带(1)具有至少1层树脂层(3)，关于树脂层(3)，储能模量在60℃～80℃的任意温度条件下为10000～200000Pa，熔体流动速率为10～200g/10min。</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAOcQxwVXDzD1Jw9XF1Dgny9_N0VnD29w3w93P1C1Fw9HNR8HUN8fB3UfB3UwgI8nd2DQ729HPHqpqHgTUtMac4lRdKczMourmGOHvophbkx6cWFyQmp-allsQ7-xkaGhmYmpobmzkaE6MGAI6BLbs</recordid><startdate>20201208</startdate><enddate>20201208</enddate><creator>OKURA MASATO</creator><scope>EVB</scope></search><sort><creationdate>20201208</creationdate><title>TAPE FOR ELECTRONIC COMPONENT AND METHOD OF PROCESSING ELECTRONIC COMPONENT</title><author>OKURA MASATO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112055736A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>OKURA MASATO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKURA MASATO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TAPE FOR ELECTRONIC COMPONENT AND METHOD OF PROCESSING ELECTRONIC COMPONENT</title><date>2020-12-08</date><risdate>2020</risdate><abstract>Provided are a tape for an electronic component and a method of processing an electronic component, which can sufficiently follow a semiconductor wafer having a bump with a large height and can prevent a dimple from occurring on the ground surface of the semiconductor wafer. The tape 1 for an electronic component according to the present invention is characterized in that the tape 1 has at least one resin layer 3, the resin layer 3 has a storage modulus of 10,000 to 200,000 Pa at any temperature of 60 DEG C to 80 DEG C, and the melt flow rate is 10 g/10 min to 200 g/10 min.
提供即使对于具有高度大的凸块的半导体晶片亦可充分进行追随，并且可防止在半导体晶片磨削面产生凹痕的电子部件用胶带及电子部件的加工方法。基于本发明的电子部件用胶带(1)具有至少1层树脂层(3)，关于树脂层(3)，储能模量在60℃～80℃的任意温度条件下为10000～200000Pa，熔体流动速率为10～200g/10min。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | TAPE FOR ELECTRONIC COMPONENT AND METHOD OF PROCESSING ELECTRONIC COMPONENT |
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