Manufacturing method of high-thickness-diameter-ratio through-blind co-plating PCB

The invention relates to a manufacturing method of a high-thickness-diameter-ratio through-blind co-plating PCB (Printed Circuit Board). The method comprises the following steps of drilling blind holes and through holes on a manufactured multilayer board by utilizing a drilling treatment step, and then finishing copper plating on the drilled blind holes and through holes at one time by adopting pulse electroplating. The manufacturing method of the high-thickness-diameter-ratio through-blind co-plating PCB has the advantages of being few in technological process, high in efficiency, low in production cost and the like. 本发明涉及一种高厚径比通盲共镀PCB制作方法，所述制作方法为在制得的多层板上，利用钻孔处理步骤在多层板上将盲孔和通孔钻出，然后采用脉冲电镀将钻出的盲孔和通孔一次性完成镀铜的制作方法。本发明高厚径比通盲共镀PCB制作方法具有工艺流程少，效率高及生产成本低等优点。