Cutting device

The embodiment of the invention discloses a cutting device. The cutting device comprises a base, a supporting frame fixed to the upper portion of the base, a force application mechanism installed on the supporting frame and capable of generating displacement relative to the base, and a cutting blade...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHOU JIANGZE, SHAO MINGWEI, LIU JIANWANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The embodiment of the invention discloses a cutting device. The cutting device comprises a base, a supporting frame fixed to the upper portion of the base, a force application mechanism installed on the supporting frame and capable of generating displacement relative to the base, and a cutting blade installed on the force application mechanism, wherein a groove is formed in the base in the first direction, when the force application mechanism moves close to the base, and the cutting blade is driven to move synchronously so that to-be-cut materials in the groove can be cut. The device providedby the invention can quickly and efficiently realize automatic cutting of the to-be-cut materials, guarantees the cutting force of the to-be-cut materials and the smoothness of the cutting surface, and avoids the problems of poor sealing performance of the to-be-cut materials after splicing due to the fact that the cutting force, the smoothness and the like of the to-be-cut material do not meet the production requirements