CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
The present invention provides a curable resin composition which does not cause a copper exposure phenomenon even if there is little variation in film thickness between a pre-drying coating film and apost-drying coating film when a thin film is formed. The curable resin composition obtained by the p...
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| creator | YANAGIDA NOBUYUKI ARAI YASUAKI SHIRAKAWA KENICHI |
| description | The present invention provides a curable resin composition which does not cause a copper exposure phenomenon even if there is little variation in film thickness between a pre-drying coating film and apost-drying coating film when a thin film is formed. The curable resin composition obtained by the present invention is a curable resin composition containing a curable resin and an extender pigment,and is characterized in that the 60-degree gloss of a cured coating film having a film thickness of 12 [mu]m after curing of the curable resin composition is in the range of 0.5-40.0 inclusive; 0.3 gof the curable resin composition is mixed with 30 g of propylene glycol monomethyl ether acetate, when a Microtrac laser particle size analyzer is used for measuring, the average particle diameter (D50) is 0.1 [mu]m to 1.0 [mu]m, and the specific surface area (CS) is 10.0 m2/ml or more.
本发明提供即使在薄膜时干燥前涂膜及干燥后涂膜的膜厚的偏差也小、不会发生露铜现象的固化性树脂组合物。由本发明得到的固化性树脂组合物是含有固化性树脂和体质颜料的固化性树脂组合物，其特征在于，上述固化性树脂组合物的固化后膜厚为12μm的固化涂膜的60°的光泽度为0.5以上且40.0 |
| format | Patent |
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本发明提供即使在薄膜时干燥前涂膜及干燥后涂膜的膜厚的偏差也小、不会发生露铜现象的固化性树脂组合物。由本发明得到的固化性树脂组合物是含有固化性树脂和体质颜料的固化性树脂组合物，其特征在于，上述固化性树脂组合物的固化后膜厚为12μm的固化涂膜的60°的光泽度为0.5以上且40.0</description><language>chi ; eng</language><subject>ADHESIVES ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; CINEMATOGRAPHY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; FILLING PASTES ; HOLOGRAPHY ; INKS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORIGINALS THEREFOR ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201204&DB=EPODOC&CC=CN&NR=112034680A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201204&DB=EPODOC&CC=CN&NR=112034680A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANAGIDA NOBUYUKI</creatorcontrib><creatorcontrib>ARAI YASUAKI</creatorcontrib><creatorcontrib>SHIRAKAWA KENICHI</creatorcontrib><title>CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD</title><description>The present invention provides a curable resin composition which does not cause a copper exposure phenomenon even if there is little variation in film thickness between a pre-drying coating film and apost-drying coating film when a thin film is formed. The curable resin composition obtained by the present invention is a curable resin composition containing a curable resin and an extender pigment,and is characterized in that the 60-degree gloss of a cured coating film having a film thickness of 12 [mu]m after curing of the curable resin composition is in the range of 0.5-40.0 inclusive; 0.3 gof the curable resin composition is mixed with 30 g of propylene glycol monomethyl ether acetate, when a Microtrac laser particle size analyzer is used for measuring, the average particle diameter (D50) is 0.1 [mu]m to 1.0 [mu]m, and the specific surface area (CS) is 10.0 m2/ml or more.
本发明提供即使在薄膜时干燥前涂膜及干燥后涂膜的膜厚的偏差也小、不会发生露铜现象的固化性树脂组合物。由本发明得到的固化性树脂组合物是含有固化性树脂和体质颜料的固化性树脂组合物，其特征在于，上述固化性树脂组合物的固化后膜厚为12μm的固化涂膜的60°的光泽度为0.5以上且40.0</description><subject>ADHESIVES</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>FILLING PASTES</subject><subject>HOLOGRAPHY</subject><subject>INKS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORIGINALS THEREFOR</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBxDg1ydPJxVQhyDfb0U3D29w3wD_YM8fT301FwCYpUcPP08dVRACpydVEICPJ3CXUO0VFw9ANxPP1CgILhnkCGu4KTv2OQCw8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uSExOzUstiXf2MzQ0MjA2MbMwcDQmRg0AkPQtiA</recordid><startdate>20201204</startdate><enddate>20201204</enddate><creator>YANAGIDA NOBUYUKI</creator><creator>ARAI YASUAKI</creator><creator>SHIRAKAWA KENICHI</creator><scope>EVB</scope></search><sort><creationdate>20201204</creationdate><title>CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD</title><author>YANAGIDA NOBUYUKI ; ARAI YASUAKI ; SHIRAKAWA KENICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112034680A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ADHESIVES</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>FILLING PASTES</topic><topic>HOLOGRAPHY</topic><topic>INKS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORIGINALS THEREFOR</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>YANAGIDA NOBUYUKI</creatorcontrib><creatorcontrib>ARAI YASUAKI</creatorcontrib><creatorcontrib>SHIRAKAWA KENICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANAGIDA NOBUYUKI</au><au>ARAI YASUAKI</au><au>SHIRAKAWA KENICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD</title><date>2020-12-04</date><risdate>2020</risdate><abstract>The present invention provides a curable resin composition which does not cause a copper exposure phenomenon even if there is little variation in film thickness between a pre-drying coating film and apost-drying coating film when a thin film is formed. The curable resin composition obtained by the present invention is a curable resin composition containing a curable resin and an extender pigment,and is characterized in that the 60-degree gloss of a cured coating film having a film thickness of 12 [mu]m after curing of the curable resin composition is in the range of 0.5-40.0 inclusive; 0.3 gof the curable resin composition is mixed with 30 g of propylene glycol monomethyl ether acetate, when a Microtrac laser particle size analyzer is used for measuring, the average particle diameter (D50) is 0.1 [mu]m to 1.0 [mu]m, and the specific surface area (CS) is 10.0 m2/ml or more.
本发明提供即使在薄膜时干燥前涂膜及干燥后涂膜的膜厚的偏差也小、不会发生露铜现象的固化性树脂组合物。由本发明得到的固化性树脂组合物是含有固化性树脂和体质颜料的固化性树脂组合物，其特征在于，上述固化性树脂组合物的固化后膜厚为12μm的固化涂膜的60°的光泽度为0.5以上且40.0</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES PRINTED CIRCUITS USE OF MATERIALS THEREFOR WOODSTAINS |
| title | CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD |
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