CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
The present invention provides a curable resin composition which does not cause a copper exposure phenomenon even if there is little variation in film thickness between a pre-drying coating film and apost-drying coating film when a thin film is formed. The curable resin composition obtained by the p...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention provides a curable resin composition which does not cause a copper exposure phenomenon even if there is little variation in film thickness between a pre-drying coating film and apost-drying coating film when a thin film is formed. The curable resin composition obtained by the present invention is a curable resin composition containing a curable resin and an extender pigment,and is characterized in that the 60-degree gloss of a cured coating film having a film thickness of 12 [mu]m after curing of the curable resin composition is in the range of 0.5-40.0 inclusive; 0.3 gof the curable resin composition is mixed with 30 g of propylene glycol monomethyl ether acetate, when a Microtrac laser particle size analyzer is used for measuring, the average particle diameter (D50) is 0.1 [mu]m to 1.0 [mu]m, and the specific surface area (CS) is 10.0 m2/ml or more.
本发明提供即使在薄膜时干燥前涂膜及干燥后涂膜的膜厚的偏差也小、不会发生露铜现象的固化性树脂组合物。由本发明得到的固化性树脂组合物是含有固化性树脂和体质颜料的固化性树脂组合物,其特征在于,上述固化性树脂组合物的固化后膜厚为12μm的固化涂膜的60°的光泽度为0.5以上且40.0 |
---|