CONNECTING ELECTRICAL COMPONENTS

The invention relates to a backplane (1) for electrically connecting electrical components (3), and to a method for producing a backplane (1). The backplane (1) comprises a mounting board (5), conductor tracks (7) which are arranged on the mounting board (5), and at least one sensor unit (9) which i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WILKE KLAUS, POHLER DIRK, STEINDL DIETER, SEIDL JOACHIM
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to a backplane (1) for electrically connecting electrical components (3), and to a method for producing a backplane (1). The backplane (1) comprises a mounting board (5), conductor tracks (7) which are arranged on the mounting board (5), and at least one sensor unit (9) which is integrated into the mounting board (5). The at least one sensor unit (9) is integrated into the mounting board (5) by an additive manufacturing method. 本发明涉及一种用于电气连接电气构件(3)的背板(1)和一种用于制造背板(1)的方法。所述背板(1)包括承载板(5)、布置在所述承载板(5)上的带状导线(7)和至少一个集成在所述承载板(5)中的传感器单元(9)。所述至少一个传感器单元(9)通过增材制造方法集成在所述承载板(5)中。