THERMALLY-CONDUCTIVE MATERIAL LAYER AND INTERNAL STRUCTURE FOR ULTRASOUND IMAGING PROBE
An ultrasound imaging probe including a handle configured for handheld use; a support structure disposed within the handle and comprising a thermally-conductive material, the support structure furthercomprising a coupling surface and an external surface, the coupling surface disposed at a distal por...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | An ultrasound imaging probe including a handle configured for handheld use; a support structure disposed within the handle and comprising a thermally-conductive material, the support structure furthercomprising a coupling surface and an external surface, the coupling surface disposed at a distal portion of the support structure; a continuous material layer coupled to the support structure, such that the continuous material layer is disposed on the coupling surface and the external surface, the continuous material layer thereby providing a heat transmission path between the coupling surface and the external surface; and an ultrasound sensor coupled to the support structure at the coupling surface and directly in contact with the continuous material layer at the coupling surface, such thatheat from the ultrasound sensor is transmitted away to the support structure via the heat transmission path of the continuous material layer.
一种超声成像探头包括:手柄,其被配置用于手持使用;支撑结构,其被设置在所述手柄内并且包括导热材料,所述支撑结构还包括耦合表面和外表面,所述耦合表面被设置在所述支撑结构的 |
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