SEMICONDUCTOR DEVICE

The purpose of the present invention is to provide a semiconductor device capable of ensuring reliability and achieving a narrow pitch and a large number of leads. The semiconductor device includes asemiconductor element, a die pad, an encapsulating material, and a plurality of leads. The die pad has the semiconductor element mounted on a surface thereof. The encapsulating material covers the semiconductor element and encapsulates the semiconductor element. One end of each of the plurality of leads is connected to the semiconductor element inside the encapsulating material, and the other endof each of the plurality of leads is led out from a side surface of the encapsulating material. A lower surface of a package including a semiconductor element, a die pad, and an encapsulating materialis located on a rear surface side of the die pad and has a convex warped shape. 目的在于提供能够确保可靠性，并且实现引线的窄间距化及大数量化的半导体装置。半导体装置包含半导体元件、管芯焊盘、封装材料、多个引线。管芯焊盘在表面搭载有半导体元件。封装材料将半导体元件覆盖而进行封装。多个引线各自的一端在封装材料的内部与半导体元件连接，各自的另一端被从封装材料的侧面引出。包含半