Thin-wall weak-rigidity part machining and fixing method and temperature control machining platform

The invention discloses a thin-wall weak-rigidity part machining and fixing method and a temperature control machining platform. The temperature control machining platform comprises a platform frame body; a panel is arranged on the upper part of the platform frame body; and a refrigerating and heati...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU LIANG, HE BIN, XIE BINGHENG, XIONG HEQIN, WAN DEQIANG, XIAO HAIPENG, REN HAN, SU XUNZHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a thin-wall weak-rigidity part machining and fixing method and a temperature control machining platform. The temperature control machining platform comprises a platform frame body; a panel is arranged on the upper part of the platform frame body; and a refrigerating and heating assembly is fixedly installed below the panel; the refrigerating and heating assembly comprises arefrigerating sheet set and a heat dissipation device; the refrigeration sheet set comprises at least one semiconductor refrigeration sheet; the semiconductor refrigeration sheet is tightly attachedto the lower surface of the panel and can switch between a refrigeration mode and a heat dissipation mode; the heat dissipation device is tightly attached to the lower surface of the semiconductor refrigeration plate and is used for dissipating heat generated by the semiconductor refrigeration plate in the refrigeration mode. According to the method, the temperature of a bonding agent is adjustedthrough a semiconductor ref