MULTILAYER ADHESIVE FILM, AND CONNECTION STRUCTURE
The title of the invention is to provide a multilayer adhesive film comprising an anion polymerization type epoxy curing agent, and having sufficient adhesiveness in thermal compression bonding at lowtemperature and also high storage stability. A multilayer adhesive film comprises a plurality of epo...
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| creator | HIRAYAMA KENICHI |
| description | The title of the invention is to provide a multilayer adhesive film comprising an anion polymerization type epoxy curing agent, and having sufficient adhesiveness in thermal compression bonding at lowtemperature and also high storage stability. A multilayer adhesive film comprises a plurality of epoxy layers comprising an uncured epoxy polymerization compound and a latent epoxy curing agent, anda curing agent layer held between the plurality of epoxy layers and comprising an anion polymerization type non-latent epoxy curing agent.
课题是提供包含阴离子聚合型的环氧固化剂、即使以低温的热压接也具备充分的粘接性、且具备高的保存稳定性的多层粘接膜。解决手段为一种多层粘接膜，其具备：包含未固化的环氧聚合化合物和潜伏性环氧固化剂的多个环氧层；和由所述多个环氧层夹持、且包含阴离子聚合型的非潜伏性环氧固化剂的固化剂层。 |
| format | Patent |
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课题是提供包含阴离子聚合型的环氧固化剂、即使以低温的热压接也具备充分的粘接性、且具备高的保存稳定性的多层粘接膜。解决手段为一种多层粘接膜，其具备：包含未固化的环氧聚合化合物和潜伏性环氧固化剂的多个环氧层；和由所述多个环氧层夹持、且包含阴离子聚合型的非潜伏性环氧固化剂的固化剂层。</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; CONDUCTORS ; DYES ; ELECTRICITY ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201127&DB=EPODOC&CC=CN&NR=111995956A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201127&DB=EPODOC&CC=CN&NR=111995956A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRAYAMA KENICHI</creatorcontrib><title>MULTILAYER ADHESIVE FILM, AND CONNECTION STRUCTURE</title><description>The title of the invention is to provide a multilayer adhesive film comprising an anion polymerization type epoxy curing agent, and having sufficient adhesiveness in thermal compression bonding at lowtemperature and also high storage stability. A multilayer adhesive film comprises a plurality of epoxy layers comprising an uncured epoxy polymerization compound and a latent epoxy curing agent, anda curing agent layer held between the plurality of epoxy layers and comprising an anion polymerization type non-latent epoxy curing agent.
课题是提供包含阴离子聚合型的环氧固化剂、即使以低温的热压接也具备充分的粘接性、且具备高的保存稳定性的多层粘接膜。解决手段为一种多层粘接膜，其具备：包含未固化的环氧聚合化合物和潜伏性环氧固化剂的多个环氧层；和由所述多个环氧层夹持、且包含阴离子聚合型的非潜伏性环氧固化剂的固化剂层。</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDyDfUJ8fRxjHQNUnB08XAN9gxzVXDz9PHVUXD0c1Fw9vfzc3UO8fT3UwgOCQp1DgkNcuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGhpaWppamZo7GxKgBAIfvJw4</recordid><startdate>20201127</startdate><enddate>20201127</enddate><creator>HIRAYAMA KENICHI</creator><scope>EVB</scope></search><sort><creationdate>20201127</creationdate><title>MULTILAYER ADHESIVE FILM, AND CONNECTION STRUCTURE</title><author>HIRAYAMA KENICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN111995956A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRAYAMA KENICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRAYAMA KENICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTILAYER ADHESIVE FILM, AND CONNECTION STRUCTURE</title><date>2020-11-27</date><risdate>2020</risdate><abstract>The title of the invention is to provide a multilayer adhesive film comprising an anion polymerization type epoxy curing agent, and having sufficient adhesiveness in thermal compression bonding at lowtemperature and also high storage stability. A multilayer adhesive film comprises a plurality of epoxy layers comprising an uncured epoxy polymerization compound and a latent epoxy curing agent, anda curing agent layer held between the plurality of epoxy layers and comprising an anion polymerization type non-latent epoxy curing agent.
课题是提供包含阴离子聚合型的环氧固化剂、即使以低温的热压接也具备充分的粘接性、且具备高的保存稳定性的多层粘接膜。解决手段为一种多层粘接膜，其具备：包含未固化的环氧聚合化合物和潜伏性环氧固化剂的多个环氧层；和由所述多个环氧层夹持、且包含阴离子聚合型的非潜伏性环氧固化剂的固化剂层。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
| title | MULTILAYER ADHESIVE FILM, AND CONNECTION STRUCTURE |
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