MULTILAYER ADHESIVE FILM, AND CONNECTION STRUCTURE

The title of the invention is to provide a multilayer adhesive film comprising an anion polymerization type epoxy curing agent, and having sufficient adhesiveness in thermal compression bonding at lowtemperature and also high storage stability. A multilayer adhesive film comprises a plurality of epo...

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Bibliographische Detailangaben
1. Verfasser:	HIRAYAMA KENICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The title of the invention is to provide a multilayer adhesive film comprising an anion polymerization type epoxy curing agent, and having sufficient adhesiveness in thermal compression bonding at lowtemperature and also high storage stability. A multilayer adhesive film comprises a plurality of epoxy layers comprising an uncured epoxy polymerization compound and a latent epoxy curing agent, anda curing agent layer held between the plurality of epoxy layers and comprising an anion polymerization type non-latent epoxy curing agent. 课题是提供包含阴离子聚合型的环氧固化剂、即使以低温的热压接也具备充分的粘接性、且具备高的保存稳定性的多层粘接膜。解决手段为一种多层粘接膜，其具备：包含未固化的环氧聚合化合物和潜伏性环氧固化剂的多个环氧层；和由所述多个环氧层夹持、且包含阴离子聚合型的非潜伏性环氧固化剂的固化剂层。