MEASURING METHOD AND MEASURING DEVICE

This measuring method of the present disclosure includes: a step for measuring a displacement (A1); a step for placing an imaging unit (20) in a position where it is possible to do imaging of a measurement mark (M1); and a step for imaging the measurement mark (M1). The step for measuring the displa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIMURA YUJI, HIZUME HISANORI, MANABE EIJI, TSURUTA SHIGETO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:This measuring method of the present disclosure includes: a step for measuring a displacement (A1); a step for placing an imaging unit (20) in a position where it is possible to do imaging of a measurement mark (M1); and a step for imaging the measurement mark (M1). The step for measuring the displacement (A1) measures the displacement (A1) of the surface of a stacked substrate of the imaging unit(20) at a location in which is placed the measurement mark (M1) for measuring position displacement, provided on the interior of the stacked substrate for which two substrates are joined. The step for imaging the measurement mark (M1) images the measurement mark (M1) using the imaging unit (20) so that focus is maintained while the focal position is moved back and forth with respect to the focalposition, which is set in advance on the basis of the displacement (A1). 本公开的一个方式的测定方法包括测定位移(A1)的工序、将摄像部(20)配置于能够拍摄测定标记(M1)的位置的工序以及拍摄测定标记(M1)的工序。在测定位移(A1)的工序中,测定将两张基板接合而成的重合基板的、配置有用于测定位置偏离的测定标记(M1)的部位处的靠摄像部(20)侧表面的位移(A1),所述测定标