Preparation method of silicon wafer chemical mechanical fine polishing liquid

The invention relates to the field of electronic materials, in particular to a preparation method of a silicon wafer chemical mechanical fine polishing liquid. The invention prepares a polishing liquid for silicon wafer fine polishing, and an abrasive used in the polishing liquid is modified organically modified nano-silica sol. The modified organically modified nano-silica sol is grafted with water-soluble macromolecules and 3-aminopropyltriethoxysilane on the surface of silica ions. The addition of the organic groups can effectively reduce the damage of silica particles to the polishing surface in the polishing process, reduce the roughness of the polishing surface, and improve the polishing level of silicon wafers. The modification method is simple in process, easy to control during reaction and good in repeatability, and the prepared polishing liquid has an obvious polishing effect and is suitable for the field of fine polishing of silicon wafers. 本发明涉及电子材料领域，具体关于一种硅片化学机械精抛抛光液的制备方法；本发明制备了一种用于硅片精抛的抛光液，该种抛光