Modeling compounds and methods of making and using the same

Modeling compounds and methods for making the same are described. The modeling compounds, in some embodiments, comprise about 20% to about 40% by weight starch-based binder, and about 0.15% to about 1.2% by weight microspheres dispersed throughout the compounds. In some embodiments, the modeling compound further comprises vinylpyrrolidone polymers. 描述了模型复合物及其制备方法。在一些实施方案中，所述模型复合物包含约20重量％至约40重量％的淀粉基粘合剂和分散于所述复合物中的约0.15重量％至约1.2重量％的微球体。在一些实施方案中，所述模型复合物还包含乙烯吡咯烷酮聚合物。