FOAM SHEET

Provided is a foam sheet in which there is little change in permittivity even when exposed to high-humidity conditions. This foam sheet has a foam layer and an adhesive layer provided to at least oneside of the foam layer, wherein the permittivity change amount [(Y-X)*100]/X is 10 (%) or less, where...

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Bibliographische Detailangaben
Hauptverfasser:	TOKUYAMA HIDEYUKI, SAITO MAKOTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a foam sheet in which there is little change in permittivity even when exposed to high-humidity conditions. This foam sheet has a foam layer and an adhesive layer provided to at least oneside of the foam layer, wherein the permittivity change amount [(Y-X)*100]/X is 10 (%) or less, where X (F/m) is the permittivity of the foam layer immediately after the foam sheet has been allowed tosit for 2 hours under conditions where the temperature is 23 DEG C and the humidity is 50%, and Y (F/m) is the permittivity of the foam layer immediately after the foam sheet has been allowed to sitfor 24 hours under conditions where the temperature is 60 DEG C and the humidity is 95%. 提供一种其中即使当暴露于高湿度条件时介电常数的变化也小的发泡片。该发泡片具有发泡层和设置于所述发泡层的至少一侧的粘合剂层，其中介电常数变化量[(Y-X)×100]/X为10(％)以下，其中X(F/m)为在将所述发泡片在温度为23℃和湿度为50％的条件下静置2小时后即刻的所述发泡层的介电常数，并且Y(F/m)为在将所述发泡片在温度为60℃和湿度为95％的条件下静置24小时后即刻的所述发泡层的介电常数。