Mobile communication circuit board and gold plating method thereof

The invention discloses a mobile communication circuit board and a gold plating method thereof, relates to the technical field of circuit board processing, and aims to solve problems that an existingmobile communication circuit board generates relatively high heat during working, the circuit board is easily damaged, and a service life of the mobile communication circuit board is shortened. Fixingplates are arranged at the two ends of the circuit board body. The fixed plate and the circuit board body are an integrated structure; fixing holes are formed in the two fixing plates; the number ofthe fixing holes is four; an upper end surface of the circuit board body is provided with circuit textures; the circuit board body is provided with the plurality of circuit textures; and a processingchip, a heat dissipation mechanism, a power supply interface and a USB interface are installed above the circuit board body, the heat dissipation mechanism is located on one side of the processing chip, the power supply interfac