Wire-embedded circuit board, and processing method and processing equipment thereof

A wire-embedded circuit board comprises a prepreg layer, the prepreg layer comprises a reinforcing part and a bonding part, and the reinforcing part is provided with lines; and a wire layer is implanted into the bonding part, and the wire layer is arranged according to the lines. The invention discloses a processing method of a wire-embedded circuit board. The processing method comprises the stepof directly arranging a wire on a prepreg according to a set wire arrangement requirement. Processing equipment of the wire-embedded circuit board comprises a wiring machine which is used for arranging the wire on the bonding part of the prepreg according to lines of a reinforcing part of the prepreg. Accordingly, the technical effect that the roughness of the wire layer is uniform and consistentwith the physical characteristics of the wire layer in the bonding part can be achieved, and therefore the electrical performance (uniform impedance, low loss, good electromagnetic performance and thelike) of the wire layer is