Multi-module integrated interposer and semiconductor device formed thereby

The invention relates to a multi-module integrated interposer and a semiconductor device formed thereby. A semiconductor device includes a multi-module interposer for enabling communication between one or more semiconductor dies within the device and a host device on which the semiconductor device is mounted. The multi-module interposer may be formed at the wafer level and provide a fan-out signalpath to the one or more dies in the device and a fan-out signal path from the one or more dies in the device. In addition, the multi-module interposer allows any various different semiconductor package configurations to be formed at the wafer level, including, for example, a wire bond package, a flip-chip package, and a through-silicon-via (TSV) package. 本发明题为"多模块集成内插器和由此形成的半导体器件"。本发明公开了一种半导体器件，包括用于实现所述器件内的一个或多个半导体管芯与上面安装有所述半导体器件的主机设备之间的通信的多模块内插器。所述多模块内插器可以在所述晶圆级形成，并且提供到所述器件中的所述一个或多个管芯的扇出信号路径以及自所述器件中的所述一个或多个管芯的扇出信号路径。另外，所述多模块内插器允许在所述晶圆级形成任何各种不同的半导体封装构型，包括例如引线键合封装、倒装芯片封装和硅通孔(TSV)封装。