Dielectric film clamping and cutting device and method

The invention discloses a dielectric film clamping and cutting device and method. The dielectric film clamping and cutting device comprises a base plate and an opening formed in the base plate, a fixed clamping assembly is fixedly arranged on the base plate, a sliding clamping assembly capable of sliding relative to the fixed clamping assembly and clamping a dielectric film is arranged at the other end of the opening, and the dielectric film clamped by the sliding clamping assembly and the fixed clamping assembly is parallel to the upper surface of a lower cover plate; and the base plate is further provided with a fixed cutting assembly located below the fixed clamping assembly and used for cutting the dielectric film clamped by the fixed clamping assembly, and the sliding clamping assembly is provided with a sliding cutting assembly used for cutting the dielectric film clamped by the sliding clamping assembly. The dielectric film clamping and cutting device and method have the beneficial effects that full-au