PROCESS FOR MODIFICATION OF A SOLID SURFACE
The invention relates to a process for the modification of a surface of a solid material, comprising the step of contacting the surface with a surface-modifying composition under irradiation with light of a wavelength in the range of 200 to 800 nm optionally in the presence of a photoinitiator, wher...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a process for the modification of a surface of a solid material, comprising the step of contacting the surface with a surface-modifying composition under irradiation with light of a wavelength in the range of 200 to 800 nm optionally in the presence of a photoinitiator, wherein the solid material has surface groups selected from C-OH, Si-OH, C=O and C-O-C groups and wherein the surface-modifying composition comprises at least a hydrosilane and at least one reactive compound (A) other than the hydrosilane, wherein the reactive compound (A) comprises at least two functional groups selected from (meth)acrylate, (meth)acrylamide, hydroxyl, carboxylic acid, alkene, alkyne and epoxy, and wherein the amount of hydrosilane in the composition ranges between 0.5 and 99 vol%,and wherein the vol% is determined at 20 DEG C relative to the total of the surface modifying composition. The invention further relates to a solid material having a partial surface modification layer.
本发明涉及一种修饰固体材料表面的方法,所述方 |
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