Submerged pump automatic temperature-reduction cooling device
The invention discloses a submerged pump automatic temperature-reduction cooling device comprising a water pump assembly comprising a water pump body and a water pump installation connection plate connected with the top face of the water pump body. A water flow conveying assembly comprises a high-pr...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a submerged pump automatic temperature-reduction cooling device comprising a water pump assembly comprising a water pump body and a water pump installation connection plate connected with the top face of the water pump body. A water flow conveying assembly comprises a high-pressure conveying pipeline arranged on the side face of the water pump body, an elbow connected withthe other end of the high-pressure conveying pipeline, and a ball valve installed on the surface of the high-pressure conveying pipeline. A water flow spraying assembly comprises an annular round pipeconnected with the water pump installation connection plate in a sleeved mode, a first hanging piece fixed to the top face of the annular round pipe, and water outlets formed in the side face of theannular round pipe. A pipeline connection assembly comprises a straight drain pipe communicating with the side wall of the water pump body, and a bent drain pipe arranged on the side face of the straight drain pipe. In the oper |
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