CLAD MATERIAL AND METHOD FOR PRODUCING SAME

The purpose of the present invention is to provide a clad material including refined grains in a copper sheet and having an excellent elongation, a reduced elongation anisotropy, and an excellent workability, and to provide a method for producing this clad material. The clad material includes the fo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DANJO SHOICHI, HIGUCHI MASARU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a clad material including refined grains in a copper sheet and having an excellent elongation, a reduced elongation anisotropy, and an excellent workability, and to provide a method for producing this clad material. The clad material includes the followings which are roll bonded: a first layer formed of austenitic stainless steel; a second layer formed of a copper material and laminated on the first layer; and a third layer formed of austenitic stainless steel and laminated on the side of the second layer opposite to the first layer. The copper material has a composition in which the copper content is at least 99.96 mass% and the total content of metal components selected from Al, Be, Cd, Mg, Pb, Ni, P, Sn, and Cr is 0.1 to 2.0 ppm. UsingEuler angles (phi1, Phi, phi2) to represent the crystallite orientation distribution function obtained by texture analysis of the copper material surface by EBSD, the average value of the orientationdensity in the range phi2