Negative photosensitive resin composition and application thereof

A negative photosensitive resin composition includes (A) 1 to 20 weight percent of a polysiloxane compound formed by polymerizing a plurality of monomers including siloxane monomers represented by thefollowing formulas (a-1), (a-2) and (a-3); (B) 0.1 wt% to 15 wt% of an unsaturated compound; (C) 1 w...

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Bibliographische Detailangaben
Hauptverfasser:	LIN FANSEN, HU DENGGUI, LAN DAJUN, LIU HONGYUAN, ZHANG ZHIYI, ZHAN SHUTING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	A negative photosensitive resin composition includes (A) 1 to 20 weight percent of a polysiloxane compound formed by polymerizing a plurality of monomers including siloxane monomers represented by thefollowing formulas (a-1), (a-2) and (a-3); (B) 0.1 wt% to 15 wt% of an unsaturated compound; (C) 1 wt% to 20 wt% of a pigment; (D) 0.1 wt% to 5 wt% of a photoinitiator; and (E) the balance of solvent, wherein R1 to R6 are as defined in the specification. In addition, the invention also relates to an application of the negative photosensitive resin composition. 一种负型感光性树脂组合物，包括：(A)1重量百分比至20重量百分比的聚硅氧烷化合物，其由多种单体聚合而成，其中，这些单体包括如下式(a-1)、(a-2)及(a-3)所示的硅氧烷单体；(B)0.1重量百分比至15重量百分比的不饱和化合物；(C)1重量百分比至20重量百分比的颜料；(D)0.1重量百分比至5重量百分比的光引发剂；以及(E)余量为溶剂。其中，R1至R6如说明书中所定义。此外，本发明还涉及一种前述负型感光性树脂组合物的用途。