CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD

The invention relates to a curable resin composition, a dry film, a cured product, and a printed wiring board. The invention provides the curable resin composition capable of obtaining the cured product which less likely to cause discoloration of silver plating and is less in reduction of reflectance caused by the irradiation with ultraviolet rays; the dry film having a resin layer obtained from the composition; the cured product thereof; and a printed wiring board having the cured product. The curable resin composition contains (A) a curable resin and (B) titanium oxide. A sulfur concentration of the curable resin composition is 100 ppm or less. Furthermore, the curable resin composition or the like contains (A) a curable resin and (B) titanium oxide, and the sulfur concentration of the solid content of the curable resin composition is 130 ppm or less. 本发明涉及固化性树脂组合物、干膜、固化物和印刷电路板。提供可以得到难以使镀银层变色、且由紫外线照射导致的反射率降低少的固化物的固化性树脂组合物、具有由该组合物得到的树脂层的干膜、该固化物以及具有该固化物的印刷电路板。一种固化性树脂组合物等，其包含(A)固化性树脂和(B)氧化钛，前述固化性树脂组合物的硫浓度为100p