Electroplating method of circuit board boss

The invention discloses an electroplating method of a circuit board boss. The electroplating method of the circuit board boss comprises the following steps of loading a board, carrying out earlier stage treatment on the board, electroplating copper on a boss on a circuit board, carrying out secondary water scrubbing (3), pickling the boss (2), electroplating tin on the boss, carrying out secondarywater scrubbing (4) and unloading the board. The copper is electroplated by using child and mother commutating machines; and rated currents of the child and mother commutating machines are 600A/50A.According to the electroplating method of the circuit board boss, the boss electroplating efficiency is enhanced; the boss electroplating quality is improved; the boss electroplating effect is good; output currents of the child and mother commutating machines are more stable than the output curent of a traditional motor; copper electroplating does not need to be carried out for multiple times so that the process is reduced