Photovoltaic bypass diode module unit and processing technology thereof

The invention discloses a photovoltaic bypass diode module unit and a processing technology thereof, and relates to the technical field of semiconductor chip packaging, in particular to improvement ofan optical module type photovoltaic diode structure and a processing technology. The photovoltaic bypass diode module unit and the processing technology thereof are clear in polarity, convenient to identify and good in heat dissipation performance. The diode module unit comprises a first frame, a second frame, a chip, a jumper wire and a packaging body; the chip is fixedly welded to the second frame, the jumper wire connects the chip with the first frame to form a diode one-way conduction circuit, the packaging body seals the chip and the jumper wire, and the packaging body is in a U-like orC-like shape, wherein the opening direction of the U-like or C-like packaging body faces the first frame. The product is provided with the heat dissipation metal sheet (heat sink body), so that the heat dissipation effect and