Package-on-package includes fan-out sub-package

A package-on-package includes a fan-out sub-package. A package-on-package includes: a package substrate; and a fan-out sub-package mounted on the package substrate using the first connection bump andthe second connection bump. The fan-out sub-package includes a first semiconductor die and a redistribution line (RDL) pattern. The second semiconductor die is stacked on the package substrate to provide a first stepped structure, and the third semiconductor die is stacked on the second semiconductor die to provide a second stepped structure. The second semiconductor die and the third semiconductor die are connected to the package substrate through a bonding wire. 包括扇出子封装件的层叠封装件。一种层叠封装件包括：封装基板；以及使用第一连接凸块和第二连接凸块安装在封装基板上的扇出子封装件。扇出子封装件包括第一半导体管芯和再分配线RDL图案。第二半导体管芯层叠在封装基板上以提供第一阶梯结构，并且第三半导体管芯层叠在第二半导体管芯上以提供第二阶梯结构。第二半导体管芯和第三半导体管芯通过接合布线连接至封装基板。