3D package structure and methods of forming same

An embodiment is a method including the steps: forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupledto the first die, the first redistribution layer including one or more metal layers disposed in one...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN MENGZE, HUANG HUIMIN, LIU ZHONGXI, GUO XUANTING, LIN ZHIWEI, ZHENG MINGDA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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