Heat-conducting medium heat transfer performance parameter measuring device for IGBT module mounting

The invention discloses a heat-conducting medium heat transfer performance parameter measuring device for IGBT (insulated gate bipolar transistor) module mounting, which comprises: a simulated heat source for providing stable heating power; a thermal structure for air-cooling heat dissipation, local heat insulation and temperature measurement, and an intelligent tightening system which is used forproviding accurate tightening torque and torque monitoring for fastening connection of the simulated heat source, the heat-conducting medium and a heat dissipation structure bolt in the thermal structure. The heat-conducting medium parameter measuring device provided by the invention can be used for measuring the heat transfer performance parameters of the heat-conducting medium with specific physical characteristics and scale characteristics under a specific tightening load. 本发明公开一种用于IGBT模块贴装的导热介质传热性能参数测定装置，该装置包括提供稳定发热功率的模拟热源，包括用于风冷散热、局部保温隔热和温度测量的热学结构，还包括为模拟热源、导热介质与热学结构中的散热结构螺栓紧固连接提供精确拧紧扭矩及扭矩监测的智能拧紧系统。采用本发明提供的导热介质参数