Wire bonding method and optical device

The embodiment of the invention provides a wire bonding method and an optical device. The optical device comprises a carrier and an EML chip arranged on the carrier, wherein the EML chip is integratedwith an EA chip and a DFB chip, the EA chip is provided with a welding spot, the welding spot is a f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHAO ZHONGZHENG, XING MEIZHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY
Online-Zugang:	Volltext bestellen
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