Wire bonding method and optical device

The embodiment of the invention provides a wire bonding method and an optical device. The optical device comprises a carrier and an EML chip arranged on the carrier, wherein the EML chip is integratedwith an EA chip and a DFB chip, the EA chip is provided with a welding spot, the welding spot is a first solder joint, and the carrier is provided with a second solder joint and a third solder joint;a solder ball is arranged on the second solder joint on the carrier, a solder wire is arranged on the solder ball, and a first line arc is formed to the first solder joint on the EA chip and welded;and a solder line is arranged on the first solder joint, and a second line arc is formed to the third solder joint on the carrier and welded. Thus, only one solder joint is arranged on the EA chip toweld the two line arcs, parasitic capacitance and resistance generated by the circuit are effectively reduced, and the EML chip can be developed to a higher transmission rate. 本发明实施例提供了一种焊线方法和光器件，所述光器件包括载体和设置于载体上的EML芯片，所述EML芯片集成