Sensor package structure and sensing module thereof

A sensor package structure and a sensing module thereof are provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer hasan inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a transverse direction parallel to a top surface of the sensor chip, the outer lateral side is separated from an outer lateral edge by a second distance which is within a range of 1/2 to 1/3 of the first distance. Accordingly, the sensor package structure can reduce glaze and effectively reinforce the light-curing layer by forming the shielding layer at the specific position. 本发明公开一种感测器封装结构及其感测模块，所述感测器封装结构包含基板、设置于基板上的感测芯片、设置于感测芯片上的光固化层、通过光固化层而设置