一种硫酸双氧水体系的蚀铜加速剂及蚀刻药水

本发明提供一种硫酸双氧水体系的蚀铜加速剂，由肽、醇和羧酸按照肽：醇：羧酸＝10-2500：1-500：1-2000的重量比比例组成。肽和铜离子形成络合物，有效降低硫酸双氧水体系中催化双氧水分解的铜离子浓度；肽中极性基团还与双氧水形成氢键，避免双氧水受其他组分影响而分解，达到保护双氧水的目的。醇可以有效地让蚀刻药水与铜面充分接触湿润，协助蚀刻药水的起始反应，使蚀刻药水均匀地与铜面进行蚀刻，并保证蚀刻后的铜面色泽均一。蚀铜加速剂还可屏蔽氯离子，避免形成溶于蚀刻药水的氯气，使氯气与双氧水之间的反应受阻，从而解决双氧水与氯气反应致使蚀刻速率下降的问题。该蚀铜加速剂能够将氯离子浓度管控区间从2-5ppm扩大至2-10ppm，大大降低了氯离子浓度管控的难度。 The invention provides a copper etching accelerator of a sulfuric acid-hydrogen peroxide system. The copper etching accelerator is composed of peptide, alcohol and carboxylic acid according to the weight ratio of (10-2500):(1-500):(1-2000). A complex is formed by the peptide and copper ions to effectively lower the concentration of the copper ions which can catalyze the decomposition of hydrogen peroxide in the sulfuric acid-hydrogen peroxide system; and polar groups in the peptide can also form hydrogen bonds with the hydrogen peroxide to avoid the situation that the hydrogen peroxide is decomposed under the influence of other components, so that the purpose of protecting the hydrogen p