High-strength and high-conductivity copper-based composite material and preparation method thereof
The invention relates to the field of metal composite materials, in particular to a high-strength and high-conductivity copper-based composite material and a preparation method thereof. The preparation method comprises the following steps of: (1) taking a copper foil deposited with graphene as a uni...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the field of metal composite materials, in particular to a high-strength and high-conductivity copper-based composite material and a preparation method thereof. The preparation method comprises the following steps of: (1) taking a copper foil deposited with graphene as a unit material, stacking more than two layers of unit materials, putting the stacked unit materials intoa ceramic tool, coating the outer surface of the ceramic tool with a metal sheath, and packaging by vacuumizing to enable the outer surface of the ceramic tool to be tightly coated with the metal sheath; and (2) applying a pressure of 90-200MPa to the packaged composite material through inert gas at 800-1000 DEG C, and carrying out hot isostatic pressing densification treatment. The copper-basedcomposite material prepared by the preparation method has the advantages of good composite effect, high density, high molding rate, high strength and high conductivity. Meanwhile, according to the preparation method, the proce |
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