Flexible circuit board
The invention provides a flexible circuit board, which comprises a first insulating film, a second insulating film, a wiring layer and a solid deformation piece, wherein the wiring layer is located between the first insulating film and the second insulating film, the first insulating film and the se...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides a flexible circuit board, which comprises a first insulating film, a second insulating film, a wiring layer and a solid deformation piece, wherein the wiring layer is located between the first insulating film and the second insulating film, the first insulating film and the second insulating film are made of an electrically insulating material, and the solid deformation piece is made of a solid material with low elasticity and easy deformation, used for deforming under external force and cannot automatically recover the shape. According to the invention, the solid deformation piece can deform, so that the characteristic of good bending property of the flexible circuit board is ensured, and the shape of the flexible circuit board can be designed according to specificconditions; and the shape of the solid deformation piece can be kept changed after the solid deformation piece deforms, so that the shape of the flexible circuit board can be fixed, in the assemblingprocess of the flexible ci |
---|