Method for transferring micro device

The invention discloses a method for transferring a micro device. The method includes: preparing a carrier substrate with the micro device thereon, wherein an adhesive layer is between and in contactwith the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head; forming a liquid layer on a receiving substrate; and placing the micro device over the receiving substrate by the transfer head such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate. The transfer head can omit the design of a complex circuit, and due to the presence of the liquid layer, the cost of the transfer processes are reduced. 本发明公开了一种用于转移微型元件的方法。该方法包括：准备载体基板，载体基板上具有微型元件，其中黏着层位于载体基板和微型元件之间并接触载体基板和微型元件；借由转移头从载体基板上拾取微型元件；在接收基板上形成液体层；借由转移头将微型元件放置在接收基板上，使得微型元件与液体层接触并被毛细力夹持；以及将转移头移离接