Indirect heating evaporation source
The invention provides an indirect heating evaporation source capable of increasing the capacity of a container. An indirect heating deposition source (1) is provided with: a container (liner (2)) formed in a bottomed cylindrical shape and filled with a deposition material (4); a container holding s...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides an indirect heating evaporation source capable of increasing the capacity of a container. An indirect heating deposition source (1) is provided with: a container (liner (2)) formed in a bottomed cylindrical shape and filled with a deposition material (4); a container holding section (holder (3)) that holds the container; an electron source (8) that emits hot electrons (electron beams (25)) for electron impact heating of the container; a scanning coil (21) that enlarges the irradiation range of the hot electrons emitted from the electron source.
本发明提供一种能够谋求容器的大容量化的间接加热蒸镀源。间接加热蒸镀源(1)具备:容器(内衬(2)),其形成为有底的筒状,且供蒸镀材料(4)填充;容器保持部(保持件(3)),其保持容器;电子源(8),其放出用于对容器进行电子冲击加热的热电子(电子束(25));以及扫描线圈(21),其使自电子源放出的热电子的照射范围扩大。 |
---|