Semiconductor composition and application thereof
The invention discloses a semiconductor composition. The semiconductor composition comprises a semiconductor material and a semiconductor binder polymer, wherein the semiconductor binder polymer is anovel high-k binder polymer; when the semiconductor binder polymer is used in conjunction with a semi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a semiconductor composition. The semiconductor composition comprises a semiconductor material and a semiconductor binder polymer, wherein the semiconductor binder polymer is anovel high-k binder polymer; when the semiconductor binder polymer is used in conjunction with a semiconductor material, a high-mobility OTFT device with contact resistance (width normalization) as low as 90 Ohm.cm can be obtained; and moreover, when the OTFT is obviously changed from a long channel to a short channel, the mobility of the device is ensured to be only slightly reduced, so the performance of a circuit and other devices is improved.
本发明公开了一种半导体组合物,该半导体组合物包含半导体材料及半导体粘合剂聚合物,该半导体粘合剂聚合物为新型高k粘合剂聚合物,当其与半导体材料结合使用时,可以得到低至90Ohm.cm的接触电阻(宽度归一化)的高迁移率OTFT器件;并且,还可以保证当OTFT由长沟道到短沟道显著变化时,器件的迁移率的仅有小幅降低,从而改善了电路和其他器件的性能。 |
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