Apparatus heat dissipation device

The invention relates to the technical field of apparatus heat dissipation, and particularly relates to an apparatus heat dissipation device. The heat dissipation device comprises a heat dissipation main body, wherein a positioning structure and a water injection groove are arranged on the heat diss...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HU LICHU, ZHOU JIE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to the technical field of apparatus heat dissipation, and particularly relates to an apparatus heat dissipation device. The heat dissipation device comprises a heat dissipation main body, wherein a positioning structure and a water injection groove are arranged on the heat dissipation main body, and the positioning structure is used for placing a device; the water injection groove and the end surface of the device form a water injection channel, and heat dissipation liquid is injected to take away the heat of the device. According to the invention, the heat dissipation main body is arranged, the positioning structure for placing the apparatus and the water injection groove are arranged on the heat dissipation main body, the water injection groove and the end surface of the device form the water injection channel, the heat dissipation liquid is injected through the water injection groove, and the heat dissipation liquid diffuses and flows to the water injection channel through the capilla