Reworking method for copper-clad plate circuit manufacturing abnormal products and printed circuit board

The invention discloses a reworking method of copper-clad plate circuit manufacturing abnormal products. The reworking method comprises the following steps of acid pickling, film pasting, engineeringdata compensation adjustment, secondary alignment exposure, development, secondary etching, film stri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU SHUNFENG, XIE GUORONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a reworking method of copper-clad plate circuit manufacturing abnormal products. The reworking method comprises the following steps of acid pickling, film pasting, engineeringdata compensation adjustment, secondary alignment exposure, development, secondary etching, film stripping and inspection. The reworked abnormal product is a copper-clad plate subjected to one-time circuit manufacturing, oxides, oil stains, fingerprints and the like on the surface of the plate are removed in the acid pickling step, and the copper surface of the plate is roughened, so that subsequent copper plating of the copper surface is facilitated. In the step of engineering data compensation adjustment and the step of secondary alignment exposure, it is guaranteed that a short-circuit areacan be etched off through secondary etching, meanwhile, the problems of line negligence, sawteeth, steps and the like after secondary etching can be avoided, and the quality of plate reworking is improved. The invention furth