SUBSTRATE AND MULTILAYER SUBSTRATE

The invention provides a substrate and a multilayer substrate. The substrate includes a fabric-like member. First inorganic fillers exist on a surface of the fabric-like member. 本发明提供一种散热性高的基板。该基板是包含布状基材的基板，是在布状基材的表面存在第一无机填料的基板。...

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Bibliographische Detailangaben
Hauptverfasser:	YAMASHITA MASAAKI, YAMASHITA YASUHIDE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention provides a substrate and a multilayer substrate. The substrate includes a fabric-like member. First inorganic fillers exist on a surface of the fabric-like member. 本发明提供一种散热性高的基板。该基板是包含布状基材的基板，是在布状基材的表面存在第一无机填料的基板。