Connection method and device for material matching

The subject matter of the invention is a method for integrally connecting at least one semiconductor module (10, 11, 12) to at least one housing part (13) of a cooling module, with the following steps: applying at least one sintered layer to the at least one housing part (13) of the cooling module,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZIMMERMANN MATTHIAS, RANG OLIVER
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!