Connection method and device for material matching

The subject matter of the invention is a method for integrally connecting at least one semiconductor module (10, 11, 12) to at least one housing part (13) of a cooling module, with the following steps: applying at least one sintered layer to the at least one housing part (13) of the cooling module, positioning the at least one semiconductor module (10, 11, 12) on the at least one sintered layer (15, 16, 17), applying a pressure to a surface (15, 16, 17) facing away from the at least one housing part (13) of the cooling module of the at least one semiconductor module (10, 11, 12) by means of apressure unit (18), applying a counter pressure to a surface (33) of the at least one housing part (13) of the cooling module facing away from the at least one semiconductor module (10, 11, 12) a counter-pressure unit (19), and heating the at least one semiconductor module (10, 11, 12), the at least one sintered layer (15, 16, 17) and the at least one housing part (13) of the cooling module by means of a heating unit (20)