Solder paste printing tool for circuit board

The invention discloses a solder paste printing tool for a circuit board, and the tool comprises a base, and a first surface of the base being provided with at least two positioning pins and a limiting groove for accommodating the circuit board; an ejection part, arranged on the base and used for ej...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DUAN YOUFENG, CUI WEI, ZHENG WENQIANG, HASITUYA
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention discloses a solder paste printing tool for a circuit board, and the tool comprises a base, and a first surface of the base being provided with at least two positioning pins and a limiting groove for accommodating the circuit board; an ejection part, arranged on the base and used for ejecting the circuit board out of the limiting groove; and a printing screen plate, provided with screen holes corresponding to bonding pads on the circuit board, and the printing screen plate being attached to the first surface through the positioning pins. According to the printing tool, the circuitboard can be rapidly and accurately fixed, then accurate positioning of the printing screen plate is achieved through the positioning pins, accurate alignment of the circuit board and the printing screen plate is effectively guaranteed, and it is guaranteed that dislocation does not occur in the solder paste printing process. According to the printing tool, the circuit board printed with the solder paste can be rapidly t