Heat dissipation device applied to electronic equipment
The invention discloses a heat dissipation device applied to electronic equipment, and belongs to the technical field of electronic equipment heat dissipation devices. The heat dissipation device comprises a box body for accommodating the electronic equipment, wherein a cavity type radiator is arran...
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| creator | WANG RUIJING LI JIAN ZHONG YAFU SHI CHENGBING CAO QIUFENG LI QIAN |
| description | The invention discloses a heat dissipation device applied to electronic equipment, and belongs to the technical field of electronic equipment heat dissipation devices. The heat dissipation device comprises a box body for accommodating the electronic equipment, wherein a cavity type radiator is arranged in the box body, a radiating fan is arranged at one end of the cavity type radiator, a heat discharge port positioned in the wall of the box body and communicated with the outside is arranged at the other opposite end of the cavity type radiator, and a semiconductor chilling plate is arranged onthe radiator close to the electronic equipment; an air inlet is formed in the wall of one side, away from the heat outlet, of the box body; and a controller and a temperature sensor are further arranged in the box body, a temperature sampling input end of the controller is connected with the temperature sensor, and a control output end of the controller is connected with the cooling fan and the semiconductor chilling pla |
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The heat dissipation device comprises a box body for accommodating the electronic equipment, wherein a cavity type radiator is arranged in the box body, a radiating fan is arranged at one end of the cavity type radiator, a heat discharge port positioned in the wall of the box body and communicated with the outside is arranged at the other opposite end of the cavity type radiator, and a semiconductor chilling plate is arranged onthe radiator close to the electronic equipment; an air inlet is formed in the wall of one side, away from the heat outlet, of the box body; and a controller and a temperature sensor are further arranged in the box body, a temperature sampling input end of the controller is connected with the temperature sensor, and a control output end of the controller is connected with the cooling fan and the semiconductor chilling pla</description><language>chi ; eng</language><subject>BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT PUMP SYSTEMS ; HEATING ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; REFRIGERATION MACHINES, PLANTS OR SYSTEMS ; REFRIGERATION OR COOLING ; WEAPONS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201009&DB=EPODOC&CC=CN&NR=111757646A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201009&DB=EPODOC&CC=CN&NR=111757646A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG RUIJING</creatorcontrib><creatorcontrib>LI JIAN</creatorcontrib><creatorcontrib>ZHONG YAFU</creatorcontrib><creatorcontrib>SHI CHENGBING</creatorcontrib><creatorcontrib>CAO QIUFENG</creatorcontrib><creatorcontrib>LI QIAN</creatorcontrib><title>Heat dissipation device applied to electronic equipment</title><description>The invention discloses a heat dissipation device applied to electronic equipment, and belongs to the technical field of electronic equipment heat dissipation devices. 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The heat dissipation device comprises a box body for accommodating the electronic equipment, wherein a cavity type radiator is arranged in the box body, a radiating fan is arranged at one end of the cavity type radiator, a heat discharge port positioned in the wall of the box body and communicated with the outside is arranged at the other opposite end of the cavity type radiator, and a semiconductor chilling plate is arranged onthe radiator close to the electronic equipment; an air inlet is formed in the wall of one side, away from the heat outlet, of the box body; and a controller and a temperature sensor are further arranged in the box body, a temperature sampling input end of the controller is connected with the temperature sensor, and a control output end of the controller is connected with the cooling fan and the semiconductor chilling pla</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PRINTED CIRCUITS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS |
| title | Heat dissipation device applied to electronic equipment |
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