Heat dissipation device applied to electronic equipment

The invention discloses a heat dissipation device applied to electronic equipment, and belongs to the technical field of electronic equipment heat dissipation devices. The heat dissipation device comprises a box body for accommodating the electronic equipment, wherein a cavity type radiator is arran...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG RUIJING, LI JIAN, ZHONG YAFU, SHI CHENGBING, CAO QIUFENG, LI QIAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a heat dissipation device applied to electronic equipment, and belongs to the technical field of electronic equipment heat dissipation devices. The heat dissipation device comprises a box body for accommodating the electronic equipment, wherein a cavity type radiator is arranged in the box body, a radiating fan is arranged at one end of the cavity type radiator, a heat discharge port positioned in the wall of the box body and communicated with the outside is arranged at the other opposite end of the cavity type radiator, and a semiconductor chilling plate is arranged onthe radiator close to the electronic equipment; an air inlet is formed in the wall of one side, away from the heat outlet, of the box body; and a controller and a temperature sensor are further arranged in the box body, a temperature sampling input end of the controller is connected with the temperature sensor, and a control output end of the controller is connected with the cooling fan and the semiconductor chilling pla