Electronic assembly
The invention discloses an electronic assembly. The electronic assembly comprises a circuit board, a control element and a pair of first internal electric connectors. The circuit board is provided with a mounting surface, a first patterned conductive layer, a plurality of second patterned conductive...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an electronic assembly. The electronic assembly comprises a circuit board, a control element and a pair of first internal electric connectors. The circuit board is provided with a mounting surface, a first patterned conductive layer, a plurality of second patterned conductive layers, a plurality of near conductive ducts, a plurality of far conductive ducts and a first conductive path. The first patterned conductive layer is located between the mounting surface and the second patterned conductive layers. And the control element is mounted on the mounting surface of the circuit board. The pair of first internal electrical connectors is mounted on the mounting surface of the circuit board and adapted to mount a pair of memory modules. The first conductive path extendsfrom the control element to the pair of first internal electrical connectors via at least the corresponding second patterned conductive layer and the first patterned conductive layer.
本发明公开一种电子总成,其包括一线路板、一控制元件及一对第一内电连接器。线路板具有 |
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