APPARATUS AND METHOD FOR THE AUTOMATED ASSEMBLY OF A PROBE HEAD

An apparatus (1) for the automated assembly of a probe head for testing electronic devices integrated on a semiconductor wafer, comprises a support (6) adapted to support at least two parallel guides(2), which are provided with a plurality of respective guides holes (3), and at least one holding means (7a, 7b) adapted to hold a contact probe (4) to be housed in said guides holes (3), of said guides (2). Suitably, the support (6) is a movable support adapted to be moved according to a preset trajectory between a first position, wherein said contact probe (4) is held by the holding means (7a, 7b) at a predetermined position outside the guides holes (3), and a second position wherein the contact probe (4), which is held at said predetermined position, is housed in a set of guides holes (3) that are substantially concentric to each other. 一种用于自动组装用于测试集成在半导体晶片上的电子器件的探头的设备(1)，包括支撑件(6)和至少一个保持装置(7a，7b)。所述支撑件适于支撑至少两个平行的导引件(2)，所述导引件具有多个相应的导引孔(3)，所述保持装置适于保持待容纳在导引件(2)的导引孔(3)中的接触式探针(4)。适当地，支撑件(6)是适于根据在第一位置和第二位置之间预设的轨迹移动的可