SEMICONDUCTOR DEVICE

According to one embodiment of the present invention, a semiconductor device (100) is provided with a wiring substrate (1); a controller chip (2) provided on the wiring substrate (1) and sealed by a first resin composition (3); a nonvolatile memory chip (4) that is provided on the first resin compos...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AOKI HIDEO, TSUKIYAMA SATOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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